BOS Semiconductors Selects CEVA's AI DSP for Next-Generation ADAS Platforms
In a significant move within the automotive industry, CEVA, Inc. (NASDAQ: CEVA) has announced that BOS Semiconductors has licensed its advanced SensPro™ AI DSP architecture for the new Eagle-A standalone Advanced Driver Assistance System (ADAS) System-on-Chip (SoC). This collaboration aims to enhance real-time perception and sensor fusion capabilities, crucial for the evolution of software-defined vehicles.
Enhancing ADAS with Advanced Technology
The Eagle-A is designed to meet the increasing demand for sophisticated driver assistance and autonomous driving technologies. It integrates a high-performance Neural Processing Unit (NPU), a Central Processing Unit (CPU), and a Graphics Processing Unit (GPU), along with dedicated sensing interfaces for camera, LiDAR, and radar fusion. The key feature of CEVA's SensPro AI DSP lies in its optimization for pre-processing LiDAR and radar data, which significantly reduces latency in perception systems.
- The Eagle-A supports a multi-die architecture connecting with Eagle-N AI accelerator through UCIe and PCIe.
- This allows Original Equipment Manufacturers (OEMs) to customize compute performance tailored for diverse ADAS applications.
- The flexible design of BOS's Eagle series extends beyond automotive applications to fields like robotics and drones.
Industry Impact and Expert Insights
According to Jason Chae, Chief Sales & Marketing Officer at BOS Semiconductors, “Eagle-A is a next-generation SoC developed with BOS' differentiated technology, delivering domain-level compute performance, safety, and scalability optimized for ADAS applications.” He further noted that “CEVA's SensPro AI DSP plays an important role in realizing these design goals and is expected to efficiently support complex sensing workloads.”
Yaron Galitzky, Executive Vice President of the AI Division at CEVA, added, “BOS Semiconductors is driving a bold vision for next-generation ADAS, and we are proud to support that journey. Their adoption of SensPro underscores the critical role of AI DSPs for advanced sensing in ADAS and strengthens CEVA's position in the rapidly expanding automotive market.”
About the Companies Involved
Founded in 2022 by Dr. Jaehong Park, former Executive Vice President at Samsung Foundry, BOS Semiconductors is a fabless company leading the development of future-ready SoC solutions for the automotive sector. With a presence in Korea, Vietnam, Germany, and the United States, BOS has been recognized as a National Strategic Technology Enterprise in Korea.
CEVA, Inc., known for powering intelligent edge devices, boasts a robust portfolio that includes silicon and software IP, catering to a wide array of applications from 5G to advanced automotive systems. With over 20 billion devices shipped worldwide, CEVA is a cornerstone of the smart edge ecosystem.
Conclusion
The collaboration between CEVA and BOS Semiconductors marks a pivotal advancement in the ADAS landscape, promising to deliver cutting-edge technologies that enhance safety and efficiency in autonomous driving applications. For more information about CEVA's offerings, visit their official page.