SAXONBURG, Pa., Aug.  17, 2026  (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE:COHR), a global leader in photonics, today announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC)

COHR

Coherent Begins Customer Sampling of 300mm High Thermal Conductivity Silicon Carbide Substrates for AI Infrastructure

Coherent begins 300mm SiC sampling to AI partners, signaling long-term heat-management growth

<section class="insight" data-version="1">
  <section data-block="information">
    <h3>Information</h3>
    <p>SAXONBURG, Pa., Aug.  17, 2026  (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE:COHR), a global leader in photonics, today announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC)</p>
  </section>

  <section data-block="ai-summary-paragraph">
    <h3>AI Summary</h3>
    <p>Coherent announced sampling of its 300mm high-thermal-conductivity SiC substrates to AI partners, moving from internal R&amp;D to customer evaluation. The substrates aim to improve heat spreading by up to 25% and align with Coherent’s scalable 300mm manufacturing platform for AI/HPC needs, signaling longer-term revenue potential.</p>
  </section>

  <section data-block="ai-summary-bullets">
    <h3>Key Points</h3>
    <ul><li>Coherent begins sampling 300mm SiC substrates to AI partners.</li><li>Customer evaluation shifts platform from internal R&amp;D to external partners.</li><li>SiC substrates offer up to 25% better heat spreading.</li><li>Vertical integration supports scalable 300mm production.</li><li>AI/HPC demand may expand platform adoption and revenue potential.</li></ul>
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  <section data-block="companies-mentioned">
    <h3>Companies Mentioned</h3>
    <ul><li><strong>Coherent Corp (COHR)</strong>: Announced sampling milestone for 300mm SiC; potential design-wins and revenue.</li><li><strong>Undisclosed AI semiconductor partners (N/A)</strong>: Targeted by COHR’s sampling; potential future partnerships and volume opportunities.</li></ul>
  </section>

  <section data-block="category">
    <h3>Corporate Developments</h3>
    <p>Category: Corporate Developments. The release highlights a material product milestone and moves toward customer engagements, with potential long-term revenue implications if partnerships convert to volume.</p>
  </section>

  <section data-block="market-moving">
    <h3>Market-Moving</h3>
    <ul><li>Sampling to AI partners could lead to design wins and revenue.</li><li>25% heat spreading improvement expands AI data-center market opportunities.</li><li>No immediate revenue numbers; ramp depends on partnerships.</li></ul>
  </section>

  <section data-block="key-facts">
    <h3>Key Facts</h3>
    <ul><li>Date: August 17, 2026</li><li>Product: 300mm high-thermal-conductivity SiC substrates</li><li>Benefit: up to 25% better heat spreading</li><li>Milestone: sampling to leading AI semiconductor partners</li><li>Platform: scalable 300mm manufacturing; vertical integration</li></ul>
  </section>

  <section data-block="trading-thesis">
    <h3>Trading Thesis</h3>
    <p>Bullish over 6–12 months on potential design wins and higher 300mm SiC utilization.</p>
  </section>
</section>


<link type="text/css" rel="stylesheet" href="https://www.globenewswire.com/styles/gnw_nitf.css"></link><p align="left">SAXONBURG, Pa., Aug.  17, 2026  (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE:<a class="ticker" href="https://www.benzinga.com/quote/COHR">COHR</a>), a global leader in photonics, today announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners. The milestone advances Coherent’s scalable materials platform for the growing thermal management requirements of artificial intelligence (AI) and high-performance computing (HPC) systems.</p>  <p align="left">As AI processors move toward higher power densities, effective heat removal is becoming a primary constraint on system performance, reliability, and datacenter efficiency. Customer sampling moves Coherent’s 300mm SiC platform from internal development to customer evaluation across the AI semiconductor ecosystem.</p>  <p align="left">Silicon carbide combines high thermal conductivity, mechanical strength, and thermal stability for next-generation heat spreaders and related packaging solutions. Coherent’s vertically integrated capabilities in SiC crystal growth, wafering, polishing, and characterization provide control across the production process and support progression toward future high-volume manufacturing. The high thermal conductivity substrates are engineered to improve heat spreading by up to 25% more than current solutions while maintaining compatibility with existing semiconductor manufacturing platforms.</p>  <p align="left">"AI performance is increasingly constrained by the industry’s ability to remove heat from next-generation processors," said Craig Mullaney, Senior Vice President and General Manager at Coherent. "Advanced SiC thermal management materials can play an important role in addressing that challenge. By combining decades of silicon carbide expertise with a scalable 300mm manufacturing platform, Coherent is helping build the materials foundation for future AI infrastructure."</p>  <p align="left">This milestone marks the next step in Coherent’s roadmap to expand its 300mm SiC platform for AI and high-performance computing. By combining customer engagement, vertically integrated materials expertise, and a scalable manufacturing strategy, Coherent is positioning its SiC capabilities to support successive generations of AI infrastructure.</p>  <p align="left">For more information, please visit: <a href="https://www.globenewswire.com/Tracker?data=G23MKnIM7vdGOA2-X-OCPeINpJI10m5GmcmBM9OuB17wReh77fr9JC5dti3nUmcISx0YNuvG-E_02iU_eQ7MbBALF6LeU60-5BpJ9e1ZKfsp7UfykWbNB3u7tMWF7ZKAzK_0AnE6QmCIuKpLOiDpaeom7xjLAByA_rNIApNygUQftKGQHJfRGeBqzLSFlCaWNh8SURSdashWj1qN9n0yHzioHTSDi8xmQQz6CfS65VaBsBjVspIqNq3vliubTlYGK6_ypC6i28I1T7wGQBhJn1M2AsD2f8S7ipsLQfDcdkXgXbQ8rIBRwOmLdcpkbA1iuVYCG_PGjwFf7G4DPjeagcQyRQ9UnpjuzaOKWAhsawPW68nqni-GyY_8c_LKFZpMjKeXSXJ9BzLzOCwc0Uy0INDxiuvdkt5_E1XVaQifbDxeqyWMMNffY_9K-NzHgEuKH6R1EKczb7uRfxjuFPn2FQ==" rel="nofollow" target="_blank">https://www.coherent.com/news/press-releases/Coherent-expands-silicon-carbide-platform-with-300mm-capability-to-support-growing-demand-of-ai-and-datacenters</a>.</p>  <p align="left"><strong>About Coherent</strong> </p>  <p align="left">Coherent is the global photonics leader. We harness photons to drive innovation. Industry leaders in the datacenter, communications, and industrial markets rely on Coherent’s world-leading technology to fuel their own innovation and growth.</p>  <p align="left">Founded in 1971 and operating in more than 20 countries, Coherent brings the industry’s broadest, deepest technology stack; unmatched supply chain resilience; and global scale to help its customers solve their toughest technology challenges. For more information, visit us at <a href="https://www.globenewswire.com/Tracker?data=Y0ezhRp5bBskvEMpowqXIvRkJbYKtkY_CmH_kKxQ_imnrsMZFy1AKuodPGcqkIvLKTi_0NgDgGU7cwkbB53Fmw==" rel="nofollow" target="_blank">coherent.com</a>.</p>  <p align="left"><strong><u>Media Contact</u></strong><strong>:</strong> <br></br><a href="https://www.globenewswire.com/Tracker?data=yqJUx0pj6sF7d0PuZTqKDYuSOQxZOvMyXOt90R6X2ZUgApfctrJMFcJCIUkLI-04g9_WvgmedDrWcp_X4bA-t7XGWX1J3k42Hn92hCTAIqFJRSkKpTm9P1TjDV3mPIVG" rel="nofollow" target="_blank">innovations@coherent.com</a> </p>  <p align="left">An image accompanying this announcement is available at <a href="https://www.globenewswire.com/Tracker?data=G23MKnIM7vdGOA2-X-OCPTj3w5BSN0bd7IUVPhKz1tVUNlgRQTa8Ex7q7NrDfJRnkN35vKOB-zv8ABEVtfwHoZlbPCyqN1QxFmf8kcSXpQnzXMX67Bz6O7PZ_3xdVd5tIxfo0J2kcjekX4wnYfCffnxq8zJCZDPiw8g4h7_qwpR3uHaJ02NhT60FQ3-9cjvuxPsCDax5T-Ox50PoPTvNW37ucYQU6zSJO5oK0DVq71HgHLo1rNBQBSctyXmqWdprF-PWT_OUq6D7UC5fbLAmBA==" rel="nofollow" target="_blank">https://www.globenewswire.com/NewsRoom/AttachmentNg/3c1bdb4c-c9ee-4556-ac7d-7022f3f1fce3</a></p> <img alt="" class="__GNW8366DE3E__IMG" src="https://www.globenewswire.com/newsroom/ti?nf=OTgxMTM4MiM3NzgwMTk3IzIwMTY2NjY="></img> <br></br><img alt="" src="https://ml.globenewswire.com/media/MWY0ZDlkOTEtZThkMi00OTIyLThkYWUtMmU0NDk3Yjk3MDY4LTEwMjgyMzktMjAyNi0wOC0xNy1lbg==/tiny/Coherent-Corp-.png" referrerpolicy="no-referrer-when-downgrade"></img><p><a href="https://www.globenewswire.com/NewsRoom/AttachmentNg/e10dcb31-4bb3-4045-b88c-4412c49e0167"><img src="https://ml.globenewswire.com/media/e10dcb31-4bb3-4045-b88c-4412c49e0167/small/cohr-blue-400x400-png.png" border="0" width="150" height="150" alt="Primary Logo"></img></a></p>

Coherent announced sampling of its 300mm high-thermal-conductivity SiC substrates to AI partners, moving from internal R&D to customer evaluation. The substrates aim to improve heat spreading by up to 25% and align with Coherent’s scalable 300mm manufacturing platform for AI/HPC needs, signaling longer-term revenue potential.

News insight

Coherent Begins Customer Sampling of 300mm High Thermal Conductivity Silicon Carbide Substrates for AI Infrastructure

AI summary

Sentiment rationale

Key facts

Corporate Developments