LOWELL, Mass., June  08, 2026  (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (&#34;MACOM&#34;), a leading supplier of semiconductor products, today announced a chip scale hot via process built on its AlGaAs diode

MTSI

MACOM Introduces its Hot Via Chip Scale Technology to Eliminate Wire Bonds

MACOM launches hot via AlGaAs process to enable mmWave surface-mount

<section class="insight" data-version="1">
  <section data-block="information">
    <h3>Information</h3>
    <p>LOWELL, Mass., June  08, 2026  (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (&amp;#34;MACOM&amp;#34;), a leading supplier of semiconductor products, today announced a chip scale hot via process built on its AlGaAs diode</p>
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  <section data-block="ai-summary-paragraph">
    <h3>AI Summary</h3>
    <p>MACOM announces a chip-scale hot via process built on AlGaAs to simplify assembly and reduce parasitics in mmWave components. The MASW-011261 SP2T switch (60–110 GHz) delivers 0.9 dB insertion loss, 30 dB isolation, and sub-20 ns switching, to be shown at IMS 2026. This could widen MACOM&#039;s addressable RF/millimeter-wave market and potentially support higher margins and upside for MACOM’s business and, by extension, MTSI.</p>
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  <section data-block="ai-summary-bullets">
    <h3>Key Points</h3>
    <ul><li>MACOM unveils AlGaAs hot via process for mmWave components.</li><li>First MASW-011261 SP2T switch targets 60–110 GHz.</li><li>Performance: 0.9 dB insertion loss, 30 dB isolation, sub-20 ns switching.</li><li>IMS 2026 in Boston (June 9–11) to showcase MASW-011261.</li></ul>
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  <section data-block="companies-mentioned">
    <h3>Companies Mentioned</h3>
    <ul><li><strong>MACOM Technology Solutions Inc. (MTSI)</strong>: Press release centers on MACOM&#039;s hot via technology; positive implications for MACOM&#039;s RF/microwave portfolio and MTSI equity.</li></ul>
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  <section data-block="category">
    <h3>Industry News</h3>
    <p>Industry News: reflects a strategic product/packaging advancement in MACOM&#039;s RF/microwave line, likely to influence near-term investor sentiment and potential design wins for MACOM and related peers including MTSI.</p>
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  <section data-block="market-moving">
    <h3>Market-Moving</h3>
    <ul><li>IMS 2026 exposure may catalyze near-term MACOM/MTSI sentiment.</li><li>MASW-011261 specs set a competitive bar for mmWave switches.</li></ul>
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  <section data-block="key-facts">
    <h3>Key Facts</h3>
    <ul><li>MASW-011261 SP2T switch operates from 60 to 110 GHz.</li><li>Insertion loss: 0.9 dB; isolation: 30 dB; switching: &lt;20 ns.</li><li>First product built on MACOM&#039;s AlGaAs hot via process.</li><li>Display at IMS 2026 in Boston, June 9–11, 2026.</li></ul>
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  <section data-block="trading-thesis">
    <h3>Trading Thesis</h3>
    <p>Bullish for MTSI in 0–12 months as MACOM’s hot via tech could lift RF/microwave design wins and growth trajectory.</p>
  </section>
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<link type="text/css" rel="stylesheet" href="https://www.globenewswire.com/styles/gnw_nitf.css"></link><p align="justify">LOWELL, Mass., June  08, 2026  (GLOBE NEWSWIRE) -- <a href="https://www.globenewswire.com/Tracker?data=lC0ytQQ-tdiOy0iTRa06Hf116lB9pyfKr7YZPOpm4LeOKJlo7KD8a4CuyIgNFJ68t6NpLLqtQZbWNv7WJ1N8NKOwVmsVOiWUl7AuBKI58UF6mt_ZdWkKtzduoQGRZS66" rel="nofollow" target="_blank">MACOM Technology Solutions Inc. ("MACOM")</a>, a leading supplier of semiconductor products, today announced a chip scale hot via process built on its AlGaAs diode technology. As an alternative to traditional chip and wire bonding and copper pillar-based surface mount technologies, MACOM's hot via process simplifies surface mount assembly while delivering low insertion loss and high isolation.</p>  <p align="justify">Hot via technology enables direct surface mount attachment by routing RF signal and ground paths vertically through the die. By removing bond wires, customers can reduce assembly complexity, improve manufacturing consistency and minimize parasitics, thereby achieving high signal integrity and reliable performance into millimeter wave (mmWave) frequencies.</p>  <p align="justify">"MACOM continues to build on its deep expertise in microwave technologies to address our customers' evolving performance and integration challenges. Our new hot via-based AlGaAs process can reduce assembly complexity while improving the high frequency performance of our integrated components," said Stephen G. Daly, President and Chief Executive Officer, MACOM.</p>  <p align="justify">Ideal for applications including switches, limiters and other control functions, the new process will be deployed on MACOM's proven AlGaAs diode technology.</p>  <p align="justify">MACOM's first product using the AlGaAs hot via process technology is the <a href="https://www.globenewswire.com/Tracker?data=GqKVX3Hc82jO3PM5Zc0jssxokzqv0i90fA7UYL60BG6-hkA_MAjvdUze6o4FpvvJ9FejLHPjYiq2THAli4DexgkNlRfRi-dQdZ4fFpOpxOVc2u-QupO9lPRn-BQn1GtT" rel="nofollow" target="_blank"><strong>MASW-011261</strong></a>, a broadband SP2T switch operating from 60 to 110 GHz. It delivers typical insertion loss of 0.9 dB, 30 dB isolation, and sub-20 ns switching speeds, all in a compact 1.87 mm x 1.98 mm chip scale package.</p>  <p align="justify">The MASW-011261 and MACOM's hot via process will be on display at MACOM's Booth #17035 at the International Microwave Symposium (IMS 2026) on June 9 to 11, 2026 in Boston, MA.</p>  <p align="justify"><strong>About MACOM</strong></p>  <p align="justify">MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. To learn more, visit <a href="https://www.globenewswire.com/Tracker?data=zVXXPC8xeJG9h97_L1ag13dJPdqjPGOewRL7BrUW_SuT_nGKIrRzww0le2CkP5z6_EufzQwqCjWmj0j5WGEGG00X8PfTMxWOoIK40PRhCc8=" rel="nofollow" target="_blank">https://www.macom.com/</a>.</p>  <p align="justify"><strong>Company Contact:</strong><br></br>MACOM Technology Solutions Inc.<br></br>Stephen Ferranti<br></br>Sr. Vice President, Corporate Development and Investor Relations<br></br>P: 978-656-2977<br></br>E: <a href="https://www.globenewswire.com/Tracker?data=JPlzkU7Nw8UFnweidN9hfKsSVANeMR4D0GnfmKvq7WcWufALk2I-flo2-a_jCzTiY5AfenkQ7dep5VhjpDG84lgqrkqIvKeEAFhc10uT-BMF3qnn4u2GmwSVRAGqu8VR" rel="nofollow" target="_blank">stephen.ferranti@macom.com</a></p> <img alt="" class="__GNW8366DE3E__IMG" src="https://www.globenewswire.com/newsroom/ti?nf=OTczMTg0NCM3NjM2MDg1IzIwMDc5OTg="></img> <br></br><img alt="" src="https://ml.globenewswire.com/media/YjA0MjMyOWMtODIyYi00YmNhLTgxMGYtNmRiZWRhZGIzZjI3LTEwMTk1NzEtMjAyNi0wNi0wOC1lbg==/tiny/MACOM-Technology-Solutions-Hol.png" referrerpolicy="no-referrer-when-downgrade"></img><p><a href="https://www.globenewswire.com/NewsRoom/AttachmentNg/a79ab6f0-6800-4764-913c-aa1e39eb512e"><img src="https://ml.globenewswire.com/media/a79ab6f0-6800-4764-913c-aa1e39eb512e/small/macomwrdmrkrgbtag-4-png.png" border="0" width="150" height="40" alt="Primary Logo"></img></a></p>

MACOM announces a chip-scale hot via process built on AlGaAs to simplify assembly and reduce parasitics in mmWave components. The MASW-011261 SP2T switch (60–110 GHz) delivers 0.9 dB insertion loss, 30 dB isolation, and sub-20 ns switching, to be shown at IMS 2026. This could widen MACOM's addressable RF/millimeter-wave market and potentially support higher margins and upside for MACOM’s business and, by extension, MTSI.

MACOM Introduces its Hot Via Chip Scale Technology to Eliminate Wire Bonds

AI Summary

Sentiment Rationale

Trading Thesis

Market-Moving

Key Facts

Companies Mentioned

Industry News

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