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Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing

1. Nordson developed PLP solutions improving underfill yields above 99%. 2. Powertech Technology, Inc. utilized Nordson's technology for efficient panel manufacturing. 3. PLP addresses complexities in semiconductor die sizes and designs. 4. Nordson's technology cuts cycle time by nearly 30%, enhancing productivity. 5. The advancements support AI, HPC, and chiplet-based architectures demands.

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Why Bullish?

Nordson's innovative advancements in semiconductor packaging may lead to increased revenue, similar to previous technology breakthroughs which resulted in stock price increases.

How important is it?

The case study highlights a significant technological edge for Nordson, which could lead to increased market share and investor confidence.

Why Long Term?

As the semiconductor industry increasingly adopts PLP solutions, sustained demand could significantly enhance Nordson's market position over time.

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CARLSBAD, Calif.--(BUSINESS WIRE)--Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson.Nordson develops a panel-level packaging solution that achieves underfilling yields above 99% for semiconductor packagingShare PTI, one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson’s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%. PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures. Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications. Nordson’s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support. About Nordson Electronics Solutions Nordson Electronics Solutions makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, electronics, and precision assembly manufacturers with the innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we've provided engineering and applications excellence to help our customers succeed. About Nordson Corporation Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at www.nordson.com.

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