Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing
1. Nordson developed PLP solutions improving underfill yields above 99%. 2. Powertech Technology, Inc. utilized Nordson's technology for efficient panel manufacturing. 3. PLP addresses complexities in semiconductor die sizes and designs. 4. Nordson's technology cuts cycle time by nearly 30%, enhancing productivity. 5. The advancements support AI, HPC, and chiplet-based architectures demands.