
New Laird™ Tflex™ CR910 liquid gap filler and Laird™ Tgrease™ 3000 thermal grease expand Qnity’s thermal management portfolio, helping engineers address growing thermal challenges across the semiconductor value

<p xmlns="http://www.w3.org/1999/xhtml" class="bwalignc">
<i xmlns="http://www.w3.org/1999/xhtml">New Laird&#x2122; Tflex&#x2122; CR910 liquid gap filler and Laird&#x2122; Tgrease&#x2122; 3000 thermal grease expand Qnity’s thermal management portfolio, helping engineers address growing thermal challenges across the semiconductor value chain</i>

</p><p xmlns="http://www.w3.org/1999/xhtml">
Qnity Electronics, Inc. ("Qnity") (NYSE:<a class="ticker" href="https://www.benzinga.com/quote/Q">Q</a>), a premier technology solutions leader across the semiconductor value chain, today announced the launch of two new thermal interface materials (TIM): Laird&#x2122; Tflex&#x2122; CR910, a two-part dispensable liquid gap filler, and Tgrease&#x2122; 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications.

</p><p xmlns="http://www.w3.org/1999/xhtml">
Increasingly complex electronic architecture has made thermal management a foundational design requirement. Designers must manage increasing power densities while working with tighter tolerance and more complex assemblies—balancing performance, manufacturability, and long-term reliability under demanding, real-world conditions.

</p><p xmlns="http://www.w3.org/1999/xhtml">
"As AI, advanced computing and electrification continue to push system performance to new levels, managing heat has become one of the industry&#39;s most important engineering challenges,&#34; said Chuck Xu, President, Interconnect Solutions, Qnity. &#34;Thermal management is no longer simply about protecting components—it&#39;s about enabling the next generation of innovation. These innovations reflect Qnity&#39;s broader commitment to delivering the technologies and engineering solutions that power progress across the semiconductor and electronics ecosystem.&#34;

</p><p xmlns="http://www.w3.org/1999/xhtml">
Drawing on its deep expertise in materials science and application engineering, Qnity works closely with customers to develop thermal management solutions that not only solve today&#39;s design challenges but also prepare for future technology roadmaps.

</p><p xmlns="http://www.w3.org/1999/xhtml">
<b xmlns="http://www.w3.org/1999/xhtml">Laird&#x2122; Tflex&#x2122; CR910</b> dispensable liquid gap filler combines high thermal conductivity of 9.2 W/mK, low thermal resistance, and a soft, compliant material profile to help engineers manage large or uneven gap tolerances while withstanding mechanical stresses and maintaining thermal performance.

</p><p xmlns="http://www.w3.org/1999/xhtml">
<b xmlns="http://www.w3.org/1999/xhtml">Laird&#x2122; Tgrease&#x2122; 3000 is</b> a non-silicone-based thermal grease developed for high-temperature applications, certified for use up to 200 °C operating temperature, and designed to provide efficient heat transfer across thin bondlines. Engineered specifically for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices operating at increasingly elevated temperatures, Tgrease&#x2122; 3000 offers 3.2 W/mK thermal conductivity, lower thermal resistance and extremely low pump-out characteristics, helping mitigate rising device temperatures, improve reliability and extend product life.

</p><p xmlns="http://www.w3.org/1999/xhtml">
Learn more about how Qnity is powering the next leap in electronics at <a xmlns="http://www.w3.org/1999/xhtml" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.qnityelectronics.com&amp;esheet=54576447&amp;newsitemid=20260728823961&amp;lan=en-US&amp;anchor=www.qnityelectronics.com&amp;index=1&amp;md5=5138f314aaf167c622f3f3da2a39931f" shape="rect">www.qnityelectronics.com</a>.

</p><p xmlns="http://www.w3.org/1999/xhtml">
<b xmlns="http://www.w3.org/1999/xhtml">About Qnity
<br xmlns="http://www.w3.org/1999/xhtml"></br></b>Qnity is a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at <a xmlns="http://www.w3.org/1999/xhtml" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.qnityelectronics.com%2F&amp;esheet=54576447&amp;newsitemid=20260728823961&amp;lan=en-US&amp;anchor=www.qnityelectronics.com&amp;index=2&amp;md5=4dbfaea2dc08f94153d1ab99dc981b7f" shape="rect">www.qnityelectronics.com</a>.

</p><p xmlns="http://www.w3.org/1999/xhtml">
Qnity&#x2122;, the Qnity Node Logo, and all products, unless otherwise noted, denoted with &#x2122; or <sup xmlns="http://www.w3.org/1999/xhtml">&#xAE;</sup> are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

</p><p xmlns="http://www.w3.org/1999/xhtml"><img xmlns="http://www.w3.org/1999/xhtml" alt="" src="https://cts.businesswire.com/ct/CT?id=bwnews&amp;sty=20260728823961r1&amp;sid=benz2&amp;distro=nx&amp;lang=en" style="width:0;height:0"></img><span xmlns="http://www.w3.org/1999/xhtml" class="bwct31415"></span></p><p xmlns="http://www.w3.org/1999/xhtml" id="mmgallerylink"><span xmlns="http://www.w3.org/1999/xhtml" id="mmgallerylink-phrase">View source version on businesswire.com: </span><span xmlns="http://www.w3.org/1999/xhtml" id="mmgallerylink-link"><a xmlns="http://www.w3.org/1999/xhtml" href="https://www.businesswire.com/news/home/20260728823961/en/" rel="nofollow">https://www.businesswire.com/news/home/20260728823961/en/</a></span></p><p xmlns="http://www.w3.org/1999/xhtml">
<b xmlns="http://www.w3.org/1999/xhtml">Media Contact 
</b><br xmlns="http://www.w3.org/1999/xhtml"></br>Ashley Boucher
<br xmlns="http://www.w3.org/1999/xhtml"></br><a xmlns="http://www.w3.org/1999/xhtml" rel="nofollow" href="mailto:Ashley.boucher@qnityelectronics.com" shape="rect">Ashley.Boucher@qnityelectronics.com</a>

</p>

Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design

Qnity launches Laird TIMs, expanding AI and automotive thermal solutions

<section class="insight" data-version="1">
  <section data-block="information">
    <h3>Information</h3>
    <p>New Laird™ Tflex™ CR910 liquid gap filler and Laird™ Tgrease™ 3000 thermal grease expand Qnity’s thermal management portfolio, helping engineers address growing thermal challenges across the semiconductor value</p>
  </section>

  <section data-block="ai-summary-paragraph">
    <h3>AI Summary</h3>
    <p>Qnity unveiled two new thermal interface materials from Laird—CR910 liquid gap filler and Tgrease 3000—designed for AI, automotive, and other high-power electronics. CR910 provides 9.2 W/mK and flexible gap accommodation; Tgrease 3000 offers 3.2 W/mK and 200°C operating range for SiC/GaN devices. The launch broadens Qnity&#039;s thermal-management offerings amid rising power density trends.</p>
  </section>

  <section data-block="ai-summary-bullets">
    <h3>Key Points</h3>
    <ul><li>Qnity launches two TIMs: CR910 and Tgrease 3000. Expands thermal portfolio for AI, automotive, and high-power electronics.</li><li>CR910: 9.2 W/mK, low resistance, soft gap filler. Supports large or uneven gap tolerances.</li><li>Tgrease 3000: non-silicone, 200°C max, 3.2 W/mK. Designed for SiC/GaN devices.</li><li>AI and electrification trends drive broader thermal-management needs. Qnity positions to capture design wins across the semiconductor value chain.</li></ul>
  </section>

  <section data-block="companies-mentioned">
    <h3>Companies Mentioned</h3>
    <ul><li><strong>Qnity Electronics, Inc. (Q)</strong>: Announces CR910 and Tgrease; expands TIM portfolio and potential revenue uplift.</li><li><strong>Laird (LRD)</strong>: TIMs sourced from Laird; strengthens Qnity’s thermal management offerings.</li></ul>
  </section>

  <section data-block="category">
    <h3>Industry News</h3>
    <p>Industry News: a product-launch update that strengthens Qnity’s growth narrative in AI/EV thermal management.</p>
  </section>

  <section data-block="market-moving">
    <h3>Market-Moving</h3>
    <ul><li>TIMs address rising heat in AI and EV workloads, supporting design wins.</li><li>CR910&#039;s 9.2 W/mK and low resistance may drive customer adoption.</li><li>Tgrease 3000 targets SiC/GaN devices at 200°C, broadening applications.</li><li>No revenue guidance; success depends on customer adoption and supply chain.</li></ul>
  </section>

  <section data-block="key-facts">
    <h3>Key Facts</h3>
    <ul><li>Qnity Electronics, NYSE: Q, launches CR910 and Tgrease 3000 TIMs.</li><li>CR910: 9.2 W/mK, low thermal resistance.</li><li>Tgrease 3000: non-silicone, up to 200°C, 3.2 W/mK.</li><li>Markets: AI, automotive; high-power electronics.</li><li>Date: July 28, 2026.</li></ul>
  </section>

  <section data-block="trading-thesis">
    <h3>Trading Thesis</h3>
    <p>Bullish near-term; expect early design wins and potential revenue lift within quarters.</p>
  </section>
</section>


<p xmlns="http://www.w3.org/1999/xhtml" class="bwalignc">
<i xmlns="http://www.w3.org/1999/xhtml">New Laird&#x2122; Tflex&#x2122; CR910 liquid gap filler and Laird&#x2122; Tgrease&#x2122; 3000 thermal grease expand Qnity’s thermal management portfolio, helping engineers address growing thermal challenges across the semiconductor value chain</i>

</p><p xmlns="http://www.w3.org/1999/xhtml">
Qnity Electronics, Inc. ("Qnity") (NYSE:<a class="ticker" href="https://www.benzinga.com/quote/Q">Q</a>), a premier technology solutions leader across the semiconductor value chain, today announced the launch of two new thermal interface materials (TIM): Laird&#x2122; Tflex&#x2122; CR910, a two-part dispensable liquid gap filler, and Tgrease&#x2122; 3000 thermal grease, both designed to help customers address increasingly complex thermal management challenges across AI, automotive and other high-power electronic applications.

</p><p xmlns="http://www.w3.org/1999/xhtml">
Increasingly complex electronic architecture has made thermal management a foundational design requirement. Designers must manage increasing power densities while working with tighter tolerance and more complex assemblies—balancing performance, manufacturability, and long-term reliability under demanding, real-world conditions.

</p><p xmlns="http://www.w3.org/1999/xhtml">
"As AI, advanced computing and electrification continue to push system performance to new levels, managing heat has become one of the industry&#39;s most important engineering challenges,&#34; said Chuck Xu, President, Interconnect Solutions, Qnity. &#34;Thermal management is no longer simply about protecting components—it&#39;s about enabling the next generation of innovation. These innovations reflect Qnity&#39;s broader commitment to delivering the technologies and engineering solutions that power progress across the semiconductor and electronics ecosystem.&#34;

</p><p xmlns="http://www.w3.org/1999/xhtml">
Drawing on its deep expertise in materials science and application engineering, Qnity works closely with customers to develop thermal management solutions that not only solve today&#39;s design challenges but also prepare for future technology roadmaps.

</p><p xmlns="http://www.w3.org/1999/xhtml">
<b xmlns="http://www.w3.org/1999/xhtml">Laird&#x2122; Tflex&#x2122; CR910</b> dispensable liquid gap filler combines high thermal conductivity of 9.2 W/mK, low thermal resistance, and a soft, compliant material profile to help engineers manage large or uneven gap tolerances while withstanding mechanical stresses and maintaining thermal performance.

</p><p xmlns="http://www.w3.org/1999/xhtml">
<b xmlns="http://www.w3.org/1999/xhtml">Laird&#x2122; Tgrease&#x2122; 3000 is</b> a non-silicone-based thermal grease developed for high-temperature applications, certified for use up to 200 °C operating temperature, and designed to provide efficient heat transfer across thin bondlines. Engineered specifically for Silicon Carbide (SiC) and Gallium Nitride (GaN) devices operating at increasingly elevated temperatures, Tgrease&#x2122; 3000 offers 3.2 W/mK thermal conductivity, lower thermal resistance and extremely low pump-out characteristics, helping mitigate rising device temperatures, improve reliability and extend product life.

</p><p xmlns="http://www.w3.org/1999/xhtml">
Learn more about how Qnity is powering the next leap in electronics at <a xmlns="http://www.w3.org/1999/xhtml" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.qnityelectronics.com&amp;esheet=54576447&amp;newsitemid=20260728823961&amp;lan=en-US&amp;anchor=www.qnityelectronics.com&amp;index=1&amp;md5=5138f314aaf167c622f3f3da2a39931f" shape="rect">www.qnityelectronics.com</a>.

</p><p xmlns="http://www.w3.org/1999/xhtml">
<b xmlns="http://www.w3.org/1999/xhtml">About Qnity
<br xmlns="http://www.w3.org/1999/xhtml"></br></b>Qnity is a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at <a xmlns="http://www.w3.org/1999/xhtml" rel="nofollow" href="https://cts.businesswire.com/ct/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.qnityelectronics.com%2F&amp;esheet=54576447&amp;newsitemid=20260728823961&amp;lan=en-US&amp;anchor=www.qnityelectronics.com&amp;index=2&amp;md5=4dbfaea2dc08f94153d1ab99dc981b7f" shape="rect">www.qnityelectronics.com</a>.

</p><p xmlns="http://www.w3.org/1999/xhtml">
Qnity&#x2122;, the Qnity Node Logo, and all products, unless otherwise noted, denoted with &#x2122; or <sup xmlns="http://www.w3.org/1999/xhtml">&#xAE;</sup> are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

</p><p xmlns="http://www.w3.org/1999/xhtml"><img xmlns="http://www.w3.org/1999/xhtml" alt="" src="https://cts.businesswire.com/ct/CT?id=bwnews&amp;sty=20260728823961r1&amp;sid=benz2&amp;distro=nx&amp;lang=en" style="width:0;height:0"></img><span xmlns="http://www.w3.org/1999/xhtml" class="bwct31415"></span></p><p xmlns="http://www.w3.org/1999/xhtml" id="mmgallerylink"><span xmlns="http://www.w3.org/1999/xhtml" id="mmgallerylink-phrase">View source version on businesswire.com: </span><span xmlns="http://www.w3.org/1999/xhtml" id="mmgallerylink-link"><a xmlns="http://www.w3.org/1999/xhtml" href="https://www.businesswire.com/news/home/20260728823961/en/" rel="nofollow">https://www.businesswire.com/news/home/20260728823961/en/</a></span></p><p xmlns="http://www.w3.org/1999/xhtml">
<b xmlns="http://www.w3.org/1999/xhtml">Media Contact 
</b><br xmlns="http://www.w3.org/1999/xhtml"></br>Ashley Boucher
<br xmlns="http://www.w3.org/1999/xhtml"></br><a xmlns="http://www.w3.org/1999/xhtml" rel="nofollow" href="mailto:Ashley.boucher@qnityelectronics.com" shape="rect">Ashley.Boucher@qnityelectronics.com</a>

</p>

Qnity unveiled two new thermal interface materials from Laird—CR910 liquid gap filler and Tgrease 3000—designed for AI, automotive, and other high-power electronics. CR910 provides 9.2 W/mK and flexible gap accommodation; Tgrease 3000 offers 3.2 W/mK and 200°C operating range for SiC/GaN devices. The launch broadens Qnity's thermal-management offerings amid rising power density trends.

News insight

Qnity Advances Thermal Management Portfolio as AI and High-Power Electronics Push Heat to the Center of Design

AI summary

Sentiment rationale

Key facts

Industry News