1. Acroname launched the USBExt3c, enhancing USB device management. 2. The product integrates Valens HDBaseT and Acroname's BrainStem technologies. 3. It offers power reliability for high-bandwidth USB devices. 4. Launch showcased at Integrated Systems Europe, boosting visibility. 5. Bigger synergy expected between Valens and Acroname post-acquisition.
The introduction of innovative products like USBExt3c suggests future growth potential for VLN.
The successful product launch demonstrates Valens' innovation, which is crucial for investor confidence.
Immediate market visibility from product launch can positively affect VLN's stock in the near term.
BOULDER, Colo., Feb. 3, 2025 /PRNewswire/ -- Acroname, a Valens Semiconductor company, today announced that it has launched a new product, the USBExt3c, a 3-port switchable hub with dedicated point-to-point USB3 and USB2 extension, combined with advanced PoE and USB-C power delivery. The product allows AV installers and OEM product manufacturers to control, manage and extend USB devices, streamlining product deployment for industries such as machine vision, corporate, and education.
Leveraging both Valens' HDBaseT and Acroname's BrainStem technologies, the USB3Ext3c addresses the challenge of power delivery and negotiation in USB-extended systems. It allows users to manage an array of USB-based peripheral devices, extending past the short cable limitations of USB2 and USB3, without worrying about power negotiation. This is a significant benefit specifically for high-bandwidth devices, such as high-end cameras, storage devices, and devices requiring high-power charging (e.g., laptops).
The new product is based on Acroname's system automation control platform, BrainStem, which provides highly modular and scalable hardware and software tools, including tools for management of USB and USB-PD, used in OEM applications around the world. The product also leverages the Valens VS6320 chipset, the first ASIC-based high-performance extension solution for USB3.2.
"This product launch represents a significant step forward in making USB a professional-grade technology," said Justin Gregg, CEO of Acroname. "It enables our customers to achieve unprecedented reliability in their USB connections for robust and flexible system design."
"This exciting product is the result of significant synergies between our two companies and is precisely what we envisioned when we acquired Acroname," said Gili Friedman, Head of the Cross-Industry Business Unit at Valens Semiconductor. "By combining the robust HDBaseT standard with Acroname's BrainStem technology, Acroname is delivering cutting-edge solutions that push the boundaries of USB extension and power delivery."
The USBExt3c will be officially unveiled at Integrated Systems Europe (ISE) 2025 from Feb 4, 2025 – Feb 7, 2025, and will be on display at the HDBaseT Alliance booth #2M500. In addition, Acroname will also be demonstrating other robust USB solutions that maximize system visibility, which are compatible with AVI-SPL's Symphony platform and Sennheiser's TeamConnect Bar products.
See the product page for photos and more information.
Contact Lance Davies for more information or interviews: lance.davies@acroname.com
Valens Semiconductor (NYSE: VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY.
For more information, visit https://www.valens.com/.
SOURCE Acroname