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Ceva Retains Top Spot in Wireless Connectivity IP in Latest IPnest Report

1. Ceva claims 68% market share in wireless connectivity IP for 2024. 2. Ceva is ranked #1 in Wireless Connectivity IP by IPnest. 3. Demand for smart edge devices is driving new innovation in connectivity. 4. Integrated IP portfolio enhances AI and sensor technology implementation. 5. Ceva aims to accelerate innovation across the AIoT landscape.

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FAQ

Why Very Bullish?

Ceva's commanding 68% market share positions it well against competitors, signaling strong market demand. Similar past leadership in technology sectors has correlated with significant stock gains, e.g., Nvidia during AI boom.

How important is it?

With the substantial market share and recognition from industry analysts, the news reinforces Ceva's strategic position, suggesting future revenue growth and potential stock price increases.

Why Long Term?

As smart devices proliferate, Ceva's technology will increasingly be in demand, similar to the long-term growth of IoT and AI sectors. Sustained market leadership will likely drive further revenue and stock price growth.

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68% market share in 2024; Cements Ceva's dominance in Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT IP and integral role of connectivity for smart edge devices as demand grows , /PRNewswire/ -- Reinforcing the company's pivotal role in enabling the intelligent, connected world, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced it has once again been named the #1 vendor in Wireless Connectivity IP by IPnest in its latest 2025 Design IP Report. Ceva grew its wireless connectivity IP market share to 68% in 2024 - more than 10 times larger than its closest peer. This commanding lead reflects Ceva's continued dominance in Bluetooth, Wi-Fi, UWB, 802.15.4 and cellular IoT IP solutions, which are foundational to the next generation of smart edge devices. The growing convergence of wireless connectivity, on-device AI, and sensor fusion is driving a new wave of smart edge devices, particularly in consumer and industrial SoCs and MCUs. As these devices increasingly require real-time decision-making, local data processing has become essential for reducing latency, preserving privacy, and improving energy efficiency. Ceva's integrated IP portfolio supports this shift by allowing seamless implementation of connectivity, AI NPUs, and sensor technologies - helping customers deliver smarter, more responsive, and secure products. "Wireless connectivity is foundational to the smart edge, and our continued leadership in this space reflects the trust our customers place in Ceva to deliver high-performance, low-power IP solutions," said Michael Boukaya, Chief Operating Officer at Ceva. "The latest IPnest report reinforces our strategy to build on this leadership by offering a unified IP portfolio that integrates wireless, sensing, and AI capabilities—enabling our customers to accelerate innovation across the evolving AIoT landscape." "Ceva remains the benchmark in Wireless Interface IP," said Dr. Eric Esteve, Principal Analyst at IPnest. "Their broad portfolio and consistent innovation make them the go-to partner for integrating multi-standard wireless into SoCs." The Ceva-Waves™ family offers the industry's most comprehensive wireless connectivity IP portfolio, spanning Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT. Optimized for seamless SoC and MCU integration, these IPs support both single and multi-standard configurations through the Ceva-Waves-Links platform. The portfolio also includes the Ceva-Waves Dragonfly platform, a fully integrated solution for LTE-M and NB-IoT connectivity with optional GNSS and eSIM support—ideal for low-power, wide-area applications such as asset tracking, smart metering, and industrial monitoring. Ceva recently expanded its Ceva-Waves platform to include RF IP, introducing its first Bluetooth 7 RF IP on TSMC 12nm, alongside support for IEEE 802.15.4—furthering its commitment to delivering complete, silicon-proven wireless solutions from baseband to RF. For more information, visit https://www.ceva-ip.com/product/ceva-waves-links/. About Ceva, Inc.At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 19 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks. Our headquarters are in Rockville, Maryland with a global customer base supported by operations worldwide. Our employees are among the leading experts in their areas of specialty, consistently solving the most complex design challenges, enabling our customers to bring innovative smart edge products to market. Ceva: Powering the Smart Edge™ Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram. Logo: https://mma.prnewswire.com/media/74483/ceva__inc__logo.jpg SOURCE Ceva, Inc. WANT YOUR COMPANY'S NEWS FEATURED ON PRNEWSWIRE.COM? 440k+ Newsrooms & Influencers 9k+ Digital Media Outlets 270k+ Journalists Opted In

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