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Coherent Introduces Breakthrough Diamond-Silicon Carbide Material for Next Generation Thermal Management in AI and High-Performance Computing

1. Coherent launches diamond-loaded SiC composite for AI datacenters. 2. Material boasts thermal conductivity over 800 W/m-K, outperforming copper. 3. Innovation targets energy efficiency, addressing datacenter cooling costs. 4. Composite is durable, corrosion-resistant, and supports direct liquid cooling. 5. Development meets growing demands of advanced HPC systems.

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Why Very Bullish?

This innovation positions COHR as a leader in the growing AI market, similar to how Nvidia surged with advancements in AI technology. The high performance and energy efficiency of the new material can significantly increase demand, driving revenue.

How important is it?

COHR's new product aligns with major industry trends, suggesting strong commercial potential. The emphasis on high performance and energy savings addresses critical market needs and positions COHR favorably against competitors.

Why Long Term?

The enduring energy efficiency advantages could lead to sustained market demand for years, much like the long-term benefits seen during the transition to more efficient CPUs in the computing industry.

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SAXONBURG, Pa., June 12, 2025 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in engineered materials, today announces the release of a groundbreaking diamond-loaded silicon carbide (SiC) ceramic composite, designed to tackle the thermal challenges of advanced AI datacenters and high-performance computing (HPC) systems. The patented diamond-silicon carbide material from Coherent achieves isotropic thermal conductivity exceeding 800 W/m-K, and delivers twice the performance of copper, the current industry benchmark. It also closely matches the coefficient of thermal expansion (CTE) of silicon, making it ideal for direct integration with semiconductor devices. “Diamond remains unmatched in its ability to manage extreme thermal loads in electronics,” said Steve Rummel, Senior Vice President of Engineered Materials at Coherent. “Our patented diamond-SiC outperforms traditional materials by a wide margin, enabling more reliable operation, longer component lifetimes, and significantly lower cooling costs. With cooling accounting for up to 50% of a datacenter’s energy consumption, thermal efficiency is more critical than ever.” Engineered for durability and versatility, this composite is corrosion-resistant, electrically insulating, and mechanically robust across a broad temperature range. It is fully compatible with direct liquid cooling (DLC) systems and integrates easily into modern server architectures and embedded cooling designs. Key applications include direct to chip heat spreading, microchannel cold plates (single- and two-phase), semiconductor device substrates, and other advanced solutions where copper-based materials fall short. This innovation from Coherent marks a major step forward in thermal management, addressing the growing performance and energy-efficiency needs of AI infrastructure and HPC platforms. For more information on Diamond Heat Spreaders by Coherent, please visit: Cooling Solutions for Overworked Datacenters | Coherent About Coherent  Coherent empowers market innovators to define the future through breakthrough technologies, from materials to systems. We deliver innovations that resonate with our customers in diversified applications for the industrial, communications, electronics, and instrumentation markets. Coherent has research and development, manufacturing, sales, service, and distribution facilities worldwide. For more information, please visit us at coherent.com. Media Contact: innovations@coherent.com 

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