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Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai

1. DuPont will exhibit advanced circuit materials at the Shanghai Electronics Exhibition. 2. Demand for high-performance devices is increasing due to AI and 5G technologies. 3. DuPont offers innovative materials for miniaturization and performance in PCBs. 4. New technologies support demands in AI servers and autonomous vehicles. 5. The exhibition will highlight DuPont's expertise in interconnect materials for electronics.

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Why Bullish?

DuPont's engagement in cutting-edge technologies indicates potential revenue growth. Historical investment in AI and high-tech sectors has often led to increased stock valuations.

How important is it?

The showcasing of new technologies and materials aligns with market demands, strengthening investor confidence in DD's future performance.

Why Long Term?

The long-term potential stems from ongoing advancements in technologies prioritized by major trends like AI and 5G, which drive continuous demand for DuPont's innovative materials.

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, /PRNewswire/ -- DuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025. With a diverse portfolio of advanced circuit materials and solutions designed to push the limits of fine-line technology, signal integrity, and thermal management, DuPont will be exhibiting in Booth #8A31 at National Exhibition and Convention Center (NECC) from March 24-26. "As artificial intelligence (AI), machine learning, and 5G technologies continue to advance, the demand for high-performance devices is propelling innovations in packaging substrates and high-end PCBs," said Yuan Yuan Zhou, Global Business Director, Advanced Circuit & Packaging, DuPont. "With our cutting-edge materials and integrated solutions, we are helping PCB manufacturers meet the increasing needs for miniaturization, integration, and performance, paving the way for the next generation of AI-driven substrates. Our advancement in interconnect materials plays a critical role in enabling AI infrastructure to optimize speed, efficiency, and reliability." DuPont is leveraging decades of expertise in material science to address the evolving demands of the rapidly expanding IC substrate and high-end PCB market, fueled by the surge from AI servers and data centers, networking, autonomous vehicles, and 5G. The IC substrate offerings encompass a wide array of solutions, including dielectrics, metallization chemistries for electroless copper seed layer, redistribution layer, copper pillars, solder bumps, and dry film imaging photoresists. This comprehensive portfolio tackles critical challenges in performance, miniaturization, reliability, and cost efficiency. At the show, DuPont experts will be available at the company's booth to share their in-depth knowledge on technological innovations and industry trends. Attendees can explore DuPont's comprehensive solutions for the PCB market, featuring the following product offerings: DuPont™ Circuposit™ SAP8000 electroless copper is an innovative SAP metallization technology designed for AI server CPU or GPU chip applications. This ionic-based catalyst electroless copper process is optimized for advanced packaging. It meets the demands for low-roughness dielectrics as well as low dielectric constant (Dk) and low dissipation factor (Df) properties essential for fine-line and high-frequency designs. DuPont™ Microfill™ SFP-II-M acid plating copper is a novel pattern plating solution specifically designed to optimize pattern distribution for large AI chips. It is engineered to deliver consistent pattern distribution across large unit sizes, making it ideal for high-performance computing applications. DuPont™ Riston® DI1600 & DI1600M dry film photoresist is an advanced fine line direct imaging photoresist solution specifically designed for IC substrate applications. It boasts exceptional fine line adhesion and resolution, paired with high-yield performance.   DuPont™ Riston® DWB8100M dry film photoresist is a high-performance direct imaging solution tailored for fine copper pillar and thick copper mSAP applications. It offers excellent fine line and via resolution, with strong bottom adhesion to minimize underplating risks. It ensures stable yield performance while providing a straight dry film and copper trace profile with low trace voids, making it optimal for advanced IC substrate applications. About DuPont  DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.  DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, SM or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted.  SOURCE DuPont WANT YOUR COMPANY'S NEWS FEATURED ON PRNEWSWIRE.COM? 440k+ Newsrooms & Influencers 9k+ Digital Media Outlets 270k+ Journalists Opted In

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