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Forge Nano to Unveil Commercial Single Module Semiconductor Wafer Fab ALD Tool at SEMICON Taiwan

1. Forge Nano unveils TEPHRAOne ALD tool for semiconductor production. 2. TEPHRAOne increases efficiency with sub-second coating cycles. 3. The tool addresses demand for high-speed ALD coatings in semiconductors. 4. Launch at SEMICON Taiwan signals growing interest in ALD technologies. 5. Deliveries expected by Q1 2026 may influence market dynamics.

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Why Bullish?

The introduction of advanced ALD technology can strengthen TSM's competitive position, akin to past tech innovations boosting share values.

How important is it?

The article highlights emerging technologies in semiconductor manufacturing that could impact TSM's strategic positioning.

Why Long Term?

As the semiconductor market evolves, TSM may benefit from enhanced production capabilities driven by advancements like TEPHRAOne.

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Forge Nano’s 200 mm single-wafer, thermal atomic layer deposition (ALD) platform for compound semiconductor manufacturing to be unveiled in TaipeiTool build slots available with delivery expected in Q1 2026 DENVER, Sept. 04, 2025 (GLOBE NEWSWIRE) -- Forge Nano, Inc., a technology company pioneering domestic battery and semiconductor innovations, today announced it is unveiling a new commercial single module semiconductor wafer fab atomic layer deposition (ALD) tool – TEPHRAOne. The fully automated 200 mm single module platform is outfitted with features from Forge Nano’s flagship multi-process module TEPHRA in a streamlined configuration for oxide, nitride, metal and nanolaminate coatings. TEPHRAOne 200 mm single module commercial ALD tool. "TEPHRAOne is our answer to the growing demand for commercial ALD coating speeds in a single module configuration,” said Paul Lichty, CEO of Forge Nano. “With the same high-speed deposition rates and unmatched chemical utilization as our multi-module TEPHRA, TEPHRAOne allows customers with singular coating needs to save critical floor space without sacrificing throughput and quality." TEPHRAOne is equipped to deposit oxide, nitride or nanolaminates at up to 12 nanometers per minute, while utilizing up to 90% of loaded chemical precursor, to deliver single wafer coatings at batch speeds. The commercial tool includes fast pneumatic valves and in-situ reactor pressure control enabling sub-second coating cycles. Forge Nano’s catalyzed thermal ALD process is utilized in TEPHRAOne to enable high aspect ratio processing desired by RF device, MEMs & sensors and LED & photonics applications. Forge Nano will be showcasing TEPHRAONE at SEMICON Taiwan, taking place in Taipei from September 10-12. To learn more, stop by the Forge Nano booth (#R7219) located on the 4th floor of TaiNEX 2 or download the equipment brochure here. For more information about Forge Nano, please visit www.forgenano.com. About Forge Nano Forge Nano is a technology company pioneering domestic battery and semiconductor innovations using its platform technology, Atomic Armor. Atomic Armor is a scalable, adaptable nano-scale coating system that strengthens America’s most critical systems – at the atomic level. The superior surface coatings produced by our Atomic Armor™ process allow our partners to unlock peak performance. Learn more at https://www.forgenano.com Media Contact:Will McKennaBrand Communications DirectorForge Nanowmckenna@forgenano.com(720) 432-6669 A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/07986977-fe3b-46ef-a021-0b72e11829ca

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