GlobalFoundries Announces New York Advanced Packaging and Photonics Center
1. GlobalFoundries announces a new U.S. chip packaging center in New York. 2. The center aims to meet growing demand in AI and defense sectors. 3. Investments total $575 million, creating approximately 100 jobs. 4. U.S. funding of $75 million supplements New York State's support. 5. Center enhances domestic semiconductor capabilities, reducing reliance on Asia.