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New HV SiC module expands NAVTS addressable market in grid tech; similar past HV module introductions have driven short-term stock moves, contingent on customer uptake and backlog clarity.
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Navitas unveiled a 2300V, 8 mΩ SiCPAK G power module using GeneSiC Trench-Assisted Planar technology to maximize RDS(on) and power density for grid infrastructure. The release targets solid-state transformers, grid-scale storage, solar inverters, and megawatt charging, signaling an expanding addressable market for high-voltage SiC solutions.
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