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ChipMOS to Present at BofA Securities 2025 Asia Tech Conference

1. ChipMOS to present at BofA Asia Tech Conference on March 20, 2025. 2. Management will discuss financial results, trends, and growth opportunities. 3. ChipMOS is a key OSAT provider with advanced facilities in Taiwan. 4. Company's investor presentation accessible on its website for stakeholders. 5. Forward-looking statements indicate potential future growth and risks.

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FAQ

Why Bullish?

The upcoming presentation may attract investor interest and boost stock activity, similar to past conferences driving up semiconductor stocks.

How important is it?

The announcement of the investor presentation is crucial for market visibility and investor engagement, potentially leading to stock price appreciations.

Why Short Term?

Investor discussions and news from the conference could lead to immediate market reactions.

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TSMNVDAASML
HSINCHU, March 13, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 andNasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will present to institutional investors at the BofA Securities 2025 Asia Tech Conference, at the Grand Hyatt Taipei on Thursday, March 20, 2025. Management from the Company, including Jesse Huang, Senior Vice President of Strategy and Investor Relations, will discuss the Company's recent financial results, business trends and growth opportunities.  The Company's investor presentation is available on the investor relations' section of its website at www.chipmos.com. About ChipMOS TECHNOLOGIES INC.: ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 andNasdaq: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide. Forward-Looking Statements: This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") and in the Company's other filings with the SEC. Contacts: In Taiwan Jesse Huang ChipMOS TECHNOLOGIES INC. +886-6-5052388 ext. 7715 [email protected] In the U.S. David Pasquale Global IR Partners +1-914-337-8801 [email protected] SOURCE ChipMOS TECHNOLOGIES INC.

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